Spray furnace overview:
Spray flux is the first step in ensuring the quality of the solder. Its main function is to uniformly apply the flux, remove the oxide layer on the solder surface of the PCB and components, and prevent reoxidation during soldering. The flux should be applied evenly, so as not to accumulate as much as possible, otherwise it will lead to short circuit or open circuit.
At present, no-clean flux is generally used, because the no-clean flux has very little solid content, and the non-volatile content is only 1/5 to 1/20. Therefore, the flux must be applied by a spray-type soldering system to ensure a uniform, fine and thin flux coating on the PCB, so that the flux will not be caused by the first scrubbing and flux evaporation. Insufficient quantity and insufficient activity lead to short circuit and tipping of the solder joint.
The use of micro-nozzles to spray flux under a certain air pressure is the mainstream of future development. In this way, the flux is uniform, the particles are small, and the control is easy. The spray height, width and flow rate can be automatically adjusted.
Equipment structure:
The flux sprayer shell is made of 1.2MM iron plate, and the surface of the iron plate is sprayed with high temperature resistant paint. ST-6 pure copper nozzle, the inner wall of the nozzle is made by a unique grinding process to ensure that it will not be corroded by flux. ST-6 is a wave soldering flux nozzle that represents the future direction of spray flux technology. The main features are: good atomization effect, uniform fluxing, good wettability of the flux, complete removal of oxide on the circuit board, and the formation of a uniform anti-oxidation film on the circuit board. The small tension can optimize the immersion tin effect. The air pressure valve with filtered water function adjusts the working pressure to achieve the most ideal atomization effect of the flux.
advantage:
? Saves more than 65% flux and saves production costs
? The flux is sprayed evenly to ensure the diffusion of solder and make the immersion tin better.
? Make the board cleaner and reduce the surface tension of the board surface
? The flux is kept in a sealed state, which is not volatile and ensures the activity of the flux.
? Reduced smoke generated during immersion tin
? Foot switch start mode, easy to operate