Profile：◆ With moderate viscosity, excellent dispersion, permeability, diffusibility and wettability, it can quickly and fully wet the copper surface, while reducing the interfacial tension between the solder and the copper surface, making the solder easily form Cu6Sn5 metal with the copper surface. Compound, good soldering effect. ◆ It has moderate activity, so it can ensure good flux effect without corroding equipment and solder. ◆ It has high thermal stability, safe use process, no need to add thinner, and is harmless to the environment and operators. ◆ After the tin is sprayed on the printed board, the tin on the pad is uniform, flat and bright, and the generated Cu6Sn5 has strong bonding force with the underlying copper. And easy to operate. ◆ IC bit has no bridge short circuit phenomenon, Wuxi high phenomenon, suitable for surface mount technology. ◆ It is a water-soluble flux, so the surface after spraying tin is easy to wash with water, and there is very little foam in the washing process, no need to add defoaming agent. ◆ Suitable for vertical spray tin or horizontal tin spray process for hot circuit leveling of printed circuit boards.